The Korea Herald


US semiconductor packaging firm files lawsuit against Samsung Electronics

By Yonhap

Published : Sept. 29, 2017 - 13:12

    • Link copied

A US-based semiconductor technology company filed a lawsuit against Samsung Electronics Co. claiming patent infringement, industry sources said Friday.

According to the sources, Tessera Technologies Inc. and its affiliates claimed Samsung Electronics made use of some 24 patented items, covering a wide range of semiconductor processing, bonding and packaging technologies.
(Yonhap) (Yonhap)

The Samsung products involved in the alleged infringements include the Galaxy S6, S7 and S8 smartphones, as well as the Galaxy Note 8 phablet.

"Samsung has benefited from its use of our semiconductor technologies for 20 years, having entered into its first license with Tessera, Inc. in 1997," Xperi Corp., Tessera's holding firm said.

"Samsung's most recent semiconductor patent license expired in December 2016, but we believe it is continuing to use our patented technologies without authorization, and without paying us fair compensation," it added.

Tessera said the legal proceedings were filed at the US International Trade Commission, three US federal district courts and with "certain international jurisdictions." (Yonhap)