
SK hynix said Friday it will showcase its innovative artificial intelligence memory technology at CES 2025, the world's largest consumer electronics and IT trade show, scheduled to open in Las Vegas next week.
“We will broadly introduce solutions optimized for on-device AI and next-generation AI memory, as well as representative AI memory products such as HBM and eSSD at this CES,” said Justin Kim, chief marketing officer at SK hynix.
“Through this, we will publicize our technological competitiveness to prepare for the future as a full-stack AI memory provider.”
Under the theme of “Innovative AI, sustainable tomorrow,” the memory chip maker will present a joint pavilion alongside SK Telecom, SKC and SK Enmove, highlighting SK Group’s AI infrastructure and services. The pavilion will showcase how AI shapes a bright future, represented through the visual concept of light waves.
SK hynix, the world's first producer and supplier of 12-layer high-bandwidth memory products for fifth-generation, will showcase samples of its 16-layer HBM3E products, which were officially developed in November last year.
The technology employs advanced MR-MUF processes to enhance thermal performance and mitigate chip warping, achieving industry-leading results. This builds on its success in mass-producing the 12-layer HBM3E last year.
The exhibit will also include high-capacity, high-performance enterprise SSD products, reflecting the growing demand for AI data centers. Among these is the 122TB ‘D5-P5336’ model developed by its subsidiary Solidigm in November. It boasts the highest capacity currently available and offers exceptional power and space efficiency.
“As SK hynix succeeded in developing quadruple-level cell-based 61 (terabyte) products in December, we expect to maximize synergy based on a balanced portfolio between the two companies in the high-capacity eSSD market,” said Ahn Hyun, chief development officer at SK hynix.
SK hynix will further spotlight on-device AI products such as ‘LPCAMM23’ and ‘ZUFS 4.04,’ which improve data processing speed and power efficiency to implement AI in edge devices like PCs and smartphones.
Additionally, the company will display CXL and PIM technologies, pivotal to the next generation of data center infrastructures, alongside modularized solutions like CMM-Ax and AiMX.
The CMM-Ax, in particular, is being hailed as a groundbreaking solution that combines the scalability of CXL with computational capabilities, boosting performance and energy efficiency for next-generation server platforms.
“The changes in the world triggered by AI are expected to accelerate further this year, and SK hynix will produce sixth-generation HBM (HBM4) in the second half of this year to lead the customized HBM market to meet the diverse needs of customers,” said Kwak Noh-Jung, CEO at SK hynix. “We will continue to do our best to present new possibilities in the AI era through technological innovation and provide irreplaceable value to our customers.”