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Samsung, SK Hynix move to dominate DRAM market

Samsung, SK Hynix move to dominate DRAM market

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Published : 2013-12-30 20:10
Updated : 2013-12-30 20:10

Global chipmakers Samsung Electronics and SK Hynix are tightening their leadership in the memory market as the two have unveiled an advanced memory technology.

The two memory manufacturers announced Monday that they successfully developed the 20-nanometer class 8-gigabit low power double data rate 4 (LPDDR4) mobile DRAM.

With a data transfer speed of 3200 Mbps, the LPDDR4 products unveiled on the day are twice as fast as the chipmakers’ existing LPDDR3, and consume approximately 40 percent less energy at 1.1 volts.

“This next-generation LPDDR4 DRAM will contribute significantly to accelerating growth of the global mobile DRAM market, and will soon be the mainstream of the entire market,” said Jun Young-hyun, executive vice president of Samsung Electronics’ memory sales and marketing division.

“Samsung will continue introducing the most advanced mobile DRAM one step ahead of the rest of the industry so that global OEMs can launch innovative mobile devices with exceptional user convenience in the timeliest manner,” Jun said.

Samsung is expected to build 4-gigabyte DRAM. A gigabyte is equivalent to 8 gigabits.

The Galaxy Note 3 is equipped with 3 GB mobile DRAM.

The 4 GB mobile DRAM is effective in maximizing the capability of a 64-bit mobile application processor, which is currently applied to Apple’s iPhone 5S.

“Next-generation smartphones or tablet PCs sporting an Ultra HD display, such as the Galaxy Note 4 or Galaxy S5, will sport 4 GB mobile DRAM, possibly made of the LPDDR4 chips,” a market source said.

Samsung Electronics also said in a statement it would mass-produce its new 8-gigabit LPDDR4 DRAM within the first half of this year.

Market watchers forecast that Samsung may purchase its local rival’s products to some extent, in its efforts to balance supply and demand.

SK Hynix’s new DRAM will be mounted on flagship mobile devices in the latter half of this year, according to the world’s fourth-largest chipmaker, and will be mass-produced in earnest in 2015 when the market is fully prepared for the new DRAM.

“SK Hynix will further strengthen its competitiveness in the mobile area with the development of high density, ultrahigh speed and low-power-consuming products,” said Jin Jung-hoon, senior vice president and head of the firm’s global sales marketing division.

By Kim Young-won (wone0102@heraldcorp.com)

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